In an attempt to speed technology progress and problem-solving in microelectronics manufacturing as well as enhancing efficiency across the supply chain using emerging technologies such as AI and ML, SEMI has announced a research and development project in partnership with Cornell University.
Per the terms of the agreement, Cornell University will optimize and accelerate two critical process steps – lithography and plasma etch. The goals of this project are:
- To help accelerate the adoption of data-driven AI methodologies to streamline microelectronics operations.
- Lay the foundation for SEMI to establish data transfer and management standards
“Streamlining manufacturing processes across the microelectronics supply chain to address the rising complexity of technology development is key for the industry to keep pace with market demand and drive growth,” said Ajit Manocha, SEMI President, and CEO. “The microelectronics industry has been slow to adopt ML and AI due, in part, to IP and data security concerns that impede data-sharing. SEMI’s agreement with Cornell, supported by ARL, is an important step in using ML and AI techniques to tackle this and other issues and bring new technologies to market faster.”
Tools and materials from several SEMI members will be used for the project at Cornell University’s Nanoscale Science & Technology Facility (CNF).
The budget for this project, that is expected to run for one year, will be provided by the ARL grant, SEMI as well as through in-kind contributions from companies in the form of materials and testing services.
The principal investigators for the project from Cornell University are Dr. Christopher K. Ober – Professor of Materials Engineering and Director of the CNF, and Dr. Amit Lal, Professor in the School of Electrical and Computer Engineering. Dr. Peter Doerschuk, Dr. Ed Suh, and Dr. Don Tennant will also support the project with their expertise in computer systems and high-performance software and facilities management.
