IBM recently announced an agreement with Samsung to manufacture 7-nanometer (nm) microprocessors for IBM Power Systems, IBM Z and LinuxOne, high-performance computing (HPC) systems, and several of the company’s cloud offerings.
This agreement combines Samsung’s industry-leading semiconductor manufacturing with IBM’s high-performance CPU designs, a combination designed to drive unmatched systems performance. It positions IBM and Samsung as strategic partners leading the new era of high-performance computing specifically designed for AI.
“At IBM, our first priority is our clients,” said John Acocella, Vice President of Enterprise Systems and Technology Development for IBM Systems. “IBM selected Samsung to build our next generation of microprocessors because they share our level of commitment to the performance, reliability, security, and innovation that will position our clients for continued success on the next generation of IBM hardware.”
“We are excited to expand our decade-long strategic relationship with IBM with our 7nm EUV process technology,” said Ryan Lee, Vice President of Foundry Marketing at Samsung Electronics. “This collaboration is an important milestone for Samsung’s foundry business as it signifies confidence in Samsung’s cutting-edge high performance EUV process technology.”
IBM and Samsung have been collaborating for about 15 years, researching and developing various semiconductor production materials and technologies as part of IBM’s Research Alliance. Given that Samsung’s and GlobalFoundries’ fabrication processes rely on research and development conducted internally and as part of IBM’s Research Alliance, IBM developers know what to expect from these technologies.
IBM said that under the current agreement, the two companies will expand and extend the strategic partnership but did not elaborate whether this means development of a custom version of Samsung’s 7LPP manufacturing process for IBM. At present, the companies call the tech to be used for IBM’s chips as ‘7 nm EUV’. Any terms discussed as part of the deal have not been disclosed either.